::SITUS LOWONGAN KERJA|LOWONGAN KARIR|LOWONGAN PEKERJAAN::29.3.06

Vacancy in Intel Malaysia

Info lowongan kerja: di perusahaan intel penang Malaysia

Intel Malaysia is currently expanding and has many openings for engineers. Please feel free to forward to those who might be interested. For further questions, please feel free to contact me at budiyanto.junus @ intel.com

Thank you and best regards,

Budi
Intel Penang Design Center

Build your career in the Design and Development of the next generation Intel Microprocessor and Intel Architecture platform Chipsets in Penang, Malaysia

Intel Penang Design Center designs and develops Intel leading-edge microprocessor (CPU) and Intel Express Chipsets (Core Logic) solution for next generation PC
platform and computing market segment. The design center is the only site outside Intel US designing next generation Pentium´┐Ż 4 microprocessor and advanced IA platform chipsets. The design center is expanding its responsibility to advance the Intel PC platform into next level of capability building on Intel latest 65nm and 45nm (nanometers) process technology.

Be part of the silicon IC design pioneering team in developing tomorrows Microprocessor, Advanced Northbridge (Memory Controller Hub) and Southbridge
(I/O Controller Hub). Be involved in the exciting challenge of exploring & creating new technology for PC such as Hyper Treading, Multicore, Virtualization, Security, Manageability, DDR3, PCI Express, Wireless LAN (WiFi), Giga bit Ethernet. Successful candidates will be given a comprehensive class-room and on-job trainings.

We are looking for:

MICROPROCESSOR & CHIPSET DESIGN
Design Engineering Managers
Platform & Component Architects
Silicon Design & Validation Engineers
Analog Circuit Design Engineers
Mask Design Engineers
Design Automation Engineers

Responsible for the research and development of next generation Low Power Pentium 4 Microprocessor & Chipsets Silicon Design. Involve in product definition, prototyping, analog circuit design, develop and validate First-of-kind industry standard design initiative. Define, Implement and improve the state of the art design software.

Work on innovative power/performance optimization and dynamic power management including energy efficient architecture, power/performance tradeoff analysis, voltage and clock frequency distribution, dynamic power management, RTL level
power estimation and power efficient architecture verification.

BSc, MSc or PhD in Electronics/Computer Engineering. The candidate should have strong
analytical problem solving skills, be able to work independently and work at various levels of abstraction.


PLATFORM DEVELOPMENT & VALIDATION
Compatibility Validation Engineers/Technicians
Circuit Marginality Validation Engineers/Technicians
Computer Security Evaluation Engineers
Handheld Computer Validation Engineers
PC Firmware Engineers
System Validation Operation Managers
System Validation Engineers/Technicians
System Marginality Validation Engineers/Technicians
System Software Engineers

Responsible for next generation pre-launch Low Power Microprocessor, handheld and platform validation, debug and resolution of detected faults Perform Post-Silicon system validation, electrical validation, compatibility validation, BIOS validation
and debug system on IA-based platform.

Be an entrepreneur and bring Intels future desktop microprocessor and chipset products to market, from definition to product launch. Develop key technical collateral including Data Sheets, Specification Update, Platform Design Guides,
Application Notes, and other collaterals/documentation necessary to close design wins and launch products.

BSc, MSc in Electronic, computer engineering or equivalent. Good knowledge in Intel
Architecture and PC platform, experience in PC system architecture, BIOS and Driver development. Knowledge in C/C++, x86 assembly, VHDL and other software languages

PACKAGE DESIGN & ELECTRICAL ANALYSIS
Platform Application Engineering Manager
Platform Signal Integrity Engineers
Platform Power Delivery Engineers
Package Design Engineers
Thermal/ Structural Engineers
Package Development Integrator

Responsible for providing package and platform electrical design & characterization to ensure successful launch of new product. Be part of global cross-divisional teams to define silicon, package, and platform requirements to insure robust electrical network design for both signaling and power delivery. Involve in design and development of electrical networks for desktop IA-based CPU packages and platforms.

Development and automation of new thermal measurement capabilities IA32 Chipsets Thermal Test Vehicles and Test Boards - Coordination and communication of project status with internal program teams.

BSc, MSc or PhD in Electrical, Electronic engineering or equivalent. Familiar with
Electromagnetic and circuit theory, good knowledge of high speed electrical design, transmission line theory, signal integrity fundamentals. Experience with Cadence Allegro or APD tool will be an added advantage.

PRODUCT DEVELOPMENT
Product Development Engineers

Responsible for the product development of the Low Power Intel Architecture CPU and Chipset. Define and deliver Design-for-Test (DFT) solution to develop highly optimized test vectors by using state-of-the-art vector conversion tool and methods,
integrate and optimize test program through device and tester characterization. Also responsible to design and develop relevant test hardware (for example, test
interface unit) for overall device testing solution.

Manage device silicon debug to check out all the structural and functional tests. Qualify new products through performing detailed test program analysis to ensure product startup with low allowable Defects per Million (DPM) coverage, low test time,
high yield performance and meeting world class product health indicators for factory high volume manufacturing startup and ramp.

BSc or MSc in Electronics/Electrical/Computer Engineering with minimum 2-3 years relevant working experience preferred. Strong analytical problem solving skill and
able to work in a very dynamic environment independently. High volume manufacturing experience and tester knowledge will be an added advantage.


1 Comments:

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10:30 AM  

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